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With a notable 55%
share in the batch furnace market, TEL is world-renowned for
manufacturing the most reliable vertical thermal processing
systems available. The Alpha-303I, TEL's 300mm large batch thermal
processing solution, leads the industry with powerful process
capabilities and the smallest footprint on the market. TEL's
latest entry into thermal processing is the 300mm TELFORMULA.
TELFORMULA merges the advantages of batch systems (stability,
low CoO) and rapid thermal processing (short cycle times, flexibility),
providing the next evolutionary step in thermal processing.
What is Thermal Processing?
In a heated LP-CVD (Chemical Vapor Deposition) or oxidation
process, a very thin layer of dielectric material is deposited
onto the wafer surface. This dielectric layer is used as the
insulating material between transistors. In many areas of the
wafer fabrication process, wafers are heated to extremely high
temperatures in a short amount of time, in order to improve
the functionality of the transistor. TEL introduced the concept
of fast-ramp batch furnace processing to the semiconductor industry
in 1991, and remains the world market share leader today.
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