Telius,the lastest in etch systems for 300mm wafer production,offers wide process latitude and outstanding cost performance. The Telius system delivers world-class process results on a wide range of plasma etch applications,including SAC,dual damascene,low-k dielectrics,poly gate,and silicon trench etch. The robust,modular design of the system delivers a field-proven etch process that is repeatable chamber-to-chamber. The Telius's high throughput and long lifetime chamber materisls make it a market leader in cost-perwafer performance.

●DRM and SCCM chambers
●Flexible modular system expansion
●Same footprint as the 200mm UNITY lle system
●Max four chamber capability (photo two chamber system)
●High throughput,compact design and lower CoO
●Ease of maintenance
●304,305,and308 models are available in Telius